Aluminum-based Copper Clad Laminate/AL CCL/Metal base copper clad laminate
1. Composition
This kind of product is made of 1100/1060/3003 / 5052 Alloy, dielectric layer and copper foil adhesive by special resin.
2. Features
---Good heat dissipation ---Good electric insulation ---Good electromagnetic shielding ---High mechanical applications ---Excellent dimensional stability ---V-0 fire-resistance and high electrical breakdown
---Different protective films:normal temperature medium temperature High temperature
3.Applications
It is suitable for the thick-film hybrid integrated circuits, LED module, LED backlight TV,LED lighting, high power electronics, IC chip substrates, automobile,motorcycle,electric car appliance , audio, solid state reply solid state voltage regulator module and etc.
4..Purchasing Information
Usual Size |
thickness |
Copper Cladding |
Dielectric layer |
Thermal conductivity |
500*600mm 500*1200mm 1000*1200mm |
0.6mm 0.8mm 1.0mm 1.2mm 1.5mm 2.0mm 3.0mm |
HOZ 1OZ 2OZ 3OZ 4OZ 6OZ 25μm |
75μm 100μm 120μm 125μm 150μm 200μm |
0.8W/m.K 1.0W/m.K 1.5W/m.K 1.8W/m.K 2.0W/m.K 3.00W/m.K |
5. If you request details properties, please check files in download.
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